DSS-P.02.02 — Seeds / Blisters (entrapped gas)

Seeds/blisters are gas inclusions formed during melting/float manufacture, appearing as encapsulated bubbles within the glass body. When fully encapsulated, they are a manufacturing feature and not a surface-relief defect. Evaluate using VIS lighting and viewing geometry for observation consistency; product acceptance for factory inclusions is separate from post-restoration acceptance under VIS.

• Discrete, rounded or lenticular spots that remain fixed with parallax relative to the glass thickness (no boundary ring or worked perimeter).
• Most noticeable at oblique sweep; may exhibit slight optical lensing; does not respond to Non-Invasive Reveal (clean/dry).

Surface-catch class (MSRT):

• Fully encapsulated seed/blister: SC-0 (none) - a single, light, non-marring pass detects no tactile relief because the feature is within the glass, not on the exposed surface. Do not abrade or repeat.
• Open blister / burst inclusion: If the bubble has broken to the surface, it will read as a local pit/crater and may present clear catch; classify by morphology (see CAT-3/4 cues; see “Pit / Crater” term).

Visual signature:

• Encapsulated: small, stable point feature with no transition edge; no chip flanks; fixed location regardless of wipe/clean.
• Open: local pit/crater possibly with a faint halo under raking light.

Viewing/lighting: Inspect at 12 / 36 / 72 in with normal incidence and oblique sweep (~60°-120°) under raking light per VIS.

Location/access: Record surface numbering (#1-#4; laminate-internal); encapsulated features reside within the lite thickness (not between panes). If a similar cue is found to be between panes (fixed parallax in an IGU), treat as out of in-place scope.

• Encapsulated seed/blister (non-relief): Processing Feature - Not Surface Damage (outside CAT-1...CAT-4). Document and proceed per project specifications for factory inclusions.
• Open blister / surface pit: Classify by observable morphology and surface-catch (often CAT-3/4 depending on depth cues).
• Between-pane or inaccessible condition: If a look-alike defect is confirmed within IGU cavity (fixed parallax) or otherwise out of in-place scope, record CAT-5 and refer per project protocol.

• Encapsulated: No measurable surface relief at the exposed surface (SC-0).
• Open blister: presents as local crater/pit; relief depth varies; use morphology + catch rather than assigning a numeric depth in the field.

• vs. Metallic/paint specks (Residues/Overspray): Residues typically clean/soften with reveal; encapsulated blisters do not.
• vs. Micro-abrasion “pepper”: Abrasion fields show directional patterning or webbing and may escalate to slight/clear catch; encapsulated seeds are isolated and SC-0.
• vs. Hot-particle pits (Th.01): Thermal pits often exhibit bright chip flanks and clear catch; encapsulated seeds do not. Classify thermal pits per M/Th families.

• Photo set (VIS): 12 / 36 / 72 in, normal + oblique; include raking usage; where practical, capture a fixed reference to demonstrate lack of boundary/working.
• MSRT: Record SC-0 for encapsulated features (one pass only; non-marring). If open, record SC-1/SC-2 accordingly.
• Forms: Pane ID; surface numbering; worked surface Y/N; coating present on worked surface? (Y/N/Unknown); reveal status; lighting/time.
• Acceptance split: VIS governs post-restoration appearance; factory inclusions are governed by product standards/project specs-do not conflate.

Attempting “spot-correction” of an encapsulated seed can introduce a worked region (visible transition edge) that is not permitted at VIS acceptance. Keep classification appearance-only unless an open pit is confirmed.

• P.02.02 Seeds/Blisters (Processing Feature) - Discrete encapsulated inclusion observed at VIS geometry; MSRT = SC-0 (no surface relief). No transition edge or fracture morphology. Recorded as manufacturing feature; not categorized as surface damage under VIS-DA. If an open pit is present, classify by CAT-3/4 morphology; if a between-pane look-alike is confirmed, record CAT-5 and refer per project protocol.